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DateNews
Aug. 15, 2008Fairchild Semiconductor Expands Focus on Energy Efficiency with Global Manufacturing Team
Aug. 7, 2008STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard
Aug. 4, 2008Worldwide Chip Sales Up 5.4 Percent in First Half of 2008
Aug. 4, 2008UMC's Embedded DRAM, URAM Proven in 65nm Customer Silicon



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